ETERTEC® HT-120 DRY FILM PHOTORESIST
DESCRIPTION
ETERTEC® HT-120 dry film photoresist is an aqueous processable alkaline
developable, negative acting photoresist designed for print-and-etch, plating, and
tent-and-etch applications.
SPECIFICATION
Film
Type
Thickness(μm)
ETERTEC®
Color(unexposed)
Green
HT-120
50 ± 1
(exposed)
Blue
Recommended uses
Plating
Tent-and-Etch
FEATURES
* Excellent resistance to all acid plating
* High resolution
* Reliable tenting up to 0.300 inches
* Easily stripping and filterable
* Broad processing latitude in each process step
* Good contrast after exposure for easy inspection
APPLICATIONS
PRE-LAMINATION CLEANING PROCEDURE:
For maximum dry film adhesion, surfaces to be coated must be clean, dry, and free of
contaminates prior to lamination. General procedures follow:
1. Clean copper clad laminate with an automatic scrubbing machine, scrubs manually
with acid pumice slurry, or chemically cleans.
2. Water rinse.
3. 10 -15% sulfuric acid rinse.
4. Water rinse.
5. Blow-dry with clean, oil free air.
6. Oven dries at 40 - 65℃.
Process Note: Several other cleaning methods work acceptably for the ETERTEC
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HT-100 SERIES PHOTORESIST such as jet pumice scrubbers, Scotch Brite,
aluminum oxide spray, pumice brushing, and chemical cleaning.
LAMINATION:
Recommended parameters
100～1200 C (210～2500 F)
1.0～3.0m/min (3～10feet/min)
35～50psi
40～650 C (105～1500 F)
Roll temperature
Roll speed
Air assist pressure
Exit temperature
Process Note: After lamination, panels should be racked with spaces between each
panel. Allow the panels to cool for fifteen minutes. Panels should never be stacked on
top of each other, as this will cause trapped dirt particles to imprint the resist from one
board to the next. Stacking also traps heat and interferes with resist performance
during exposure or development.
EXPOSURE:
Exposure parameters
Exposure energy
Step held(ETERTEC 21-step tablet)
(40～70 mj/cm2)
Hold time
15 minutes
8 - 10 last step
ETERTEC 21 STEP HELD
PHOTOSENSITIVITY
ADHESION
LINE WIDTH (micron)
14
12
10
8
6
4
0
10
30
35
40
50
60
70
80
80
70
60
50
40
30
20
10
0
0
90 100 110 120
10
EXPOSURE ENERGY(mj/cm )
RESOLUTION
30
40
50
60
70
80
90
100 110 120
PHOTOTOOL REPRODUCTION
120
20
15
10
5
0
-5
-10
-15
-20
DIFFERENCE(%)L/S=4/4mil
LINE WIDTH (micron)
20
EXPOSURE ENERGY(mj/cm2)
2
100
80
60
40
20
0
0
10
20
30
40
50
60
70
80
0
90 100 110 120
10
20
30
40
50
60
70
80
90
100 110 120
2
EXPOSURE ENERGY(mj/cm )
2
EXPOSURE ENERGY(mj/cm )
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DEVELOPMENT:
Developing parameters
0.8～1.2% Na2CO3•H2O
28～320C (82～900 F)
50～75% of the chamber length
45～60 seconds (300 C, 50% b.p.)
1.5～2.0 kg/cm2 (22～30 psi)
Developer solution
Temperature
Breakpoint
Developing time
Pressure
RESIST LOADING:
The recommended loading limit in a batch operation is 12 mil-ft2/U.S. Gal.
DEVELOPER pH
VALUE
RESIST LOADING
11.2
11
10.8
10.6
10.4
10.2
10
9.8
9.6
9.4
0
1
2
3
RESIST LOADING(SQ ft / L)
4
5
PREPLATE CLEANING:
An effective preplate cleaning cycle will include a hot cleaner for soils, a micro etch
for the copper to create a mild etch and a acid dip similar but diluted from the
subsequent plating bath to be used. An example follows:
Hot Acid Cleaner
Water Rinse
500 C (1200 F), 5 min
Room Temperature, 1 min
Micro Etch
Water Rinse
Sulfuric Acid Dip
Water Rinse
Electroplate as usual
at least 10 microinches of Copper
Room Temperature, 1 min
10% by volume, 1 min
Room Temperature
ETCHING:
ETERTEC®HT-100 dry film photoresist is designed for use in acid etching
solutions.
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STRIPPING:
Stripping parameters
50～100 sec.
40～600 C (104～1400F)
1.0～3.0 kg/cm2 (15～45 psi)
2～4% NaOH solution
STRIPPING TIME IN SECONDS
Time
Temperature
Pressure
Concentration
STRIPPING PROPERTIES
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
0
NaOH CONCETRATION(% BY Wt. 50 C)
SAFETY AND HANDLING:
1. Avoid skin contact with unexposed resist and wash thoroughly with soap and water if contact
is made.
2. Dry film lamination may cause vapors to be generated. A well-ventilated room is necessary.
3. Open resist only in a controlled yellow light area.
4. Do not reuse the dry film release sheets or cover sheets.
STORAGE:
Store in a cool, dry location 50 C to 20℃ (400 F to 700 F) and 50 % relative humidity ±
10% to assure maximum shelf life and product performance.
WARRANTY
The information contained herein is correct to the best of our knowledge. The recommendations or suggestions contained in this
bulletin are made without guarantee or representation as to results. We suggest that you evaluated these recommendations and
suggestions in your laboratory prior to use. Our responsibility for claims arising form defects in material or workmanship or any
other breach of warranty, negligence or otherwise is limited to the purchase price of the material.
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