COA ASSIGNMENT
Roll No: CB.SC.U4CSE24761
Name: Rudraraju Ethish
Date: 20-11-2025
PROCESSOR RESEARCH ASSIGNMENT
Comparative Study of Electronic Device Processors
Course: Computer Organization and Architecture
1. INTRODUCTION
This report presents a detailed analysis of processors used in three contemporary electronic devices: the MacBook
Pro (M3 Pro), iPhone 17 Pro, and iQOO 7 smartphone. The study examines processor specifications, architectural
features, and provides comparative analysis within major processor families.
2. DEVICE 1: MACBOOK PRO WITH M3 PRO CHIP
Processor Name: Apple M3 Pro
Manufacturer: Apple Inc. (designed), TSMC (fabricated) Architecture Type: ARM-based
(Apple Silicon)
TECHNICAL SPECIFICATIONS:
• Process Technology: 3nm (N3B)
• Core Count:
- 12-core CPU (6 performance + 6 efficiency cores)
- 18-core GPU
• Clock Speed:
- Performance cores: Up to 4.05 GHz
- Efficiency cores: Up to 2.75 GHz
• Neural Engine: 16-core (15.8 trillion operations/sec)
• Memory: Unified memory architecture (18GB/36GB options)
• Memory Bandwidth: Up to 150 GB/s
NOTABLE FEATURES:
✓ Unified Memory Architecture (UMA) - CPU, GPU, and Neural Engine share memory
✓ Dynamic Caching for GPU workloads
✓ Hardware-accelerated ray tracing
✓ AV1 decode engine
✓ ProRes and ProRes RAW acceleration
✓ Secure Enclave for enhanced security
✓ Advanced power management with performance/efficiency core design
PERFORMANCE METRICS:
• Single-core Geekbench: ~3,100
• Multi-core Geekbench: ~15,000
• Power efficiency: Industry-leading performance-per-watt
3. DEVICE 2: IPHONE 17 PRO
Note: As of January 2025, the iPhone 17 Pro has not been released. Based on Apple's typical release cycle, it is
expected in September 2025.
PROJECTED SPECIFICATIONS:
• Process Technology: 3nm (likely N3P or 2nm)
• Core Count:
- 6-core CPU (2 performance + 4 efficiency cores)
- 6 or 7-core GPU
• Clock Speed: Performance cores estimated at 3.8-4.1 GHz
• Neural Engine: 16-core (projected improvement over A18)
• Memory: 8-12GB RAM
EXPECTED FEATURES:
✓ Enhanced Neural Engine for AI workloads
✓ Improved image signal processor
✓ Advanced video encoding/decoding
✓ Secure Enclave
✓ 5G modem integration
✓ ProMotion display support (120Hz)
Current Alternative (iPhone 16 Pro - A18 Pro):
• 6-core CPU (3.78 GHz performance cores)
• 6-core GPU
• 16-core Neural Engine
• 3nm process (N3E)
4. DEVICE 3: iQOO 7 (INDIA/CHINA VARIANTS)
Processor Name: Qualcomm Snapdragon 870 5G Manufacturer:
Qualcomm Technologies Inc.
Architecture Type: ARM-based (Kryo cores)
TECHNICAL SPECIFICATIONS:
• Process Technology: 7nm (TSMC N7P)
• Core Count: 8-core CPU
- 1x Kryo 585 Prime core @ 3.2 GHz (Cortex-A77 based)
- 3x Kryo 585 Gold cores @ 2.42 GHz (Cortex-A77 based)
- 4x Kryo 585 Silver cores @ 1.8 GHz (Cortex-A55 based)
• GPU: Adreno 650
• ISP: Spectra 480
• AI Engine: Hexagon 698 (15 TOPS)
• Memory: LPDDR5 RAM support (up to 12GB)
NOTABLE FEATURES:
✓ 5G connectivity (Sub-6 GHz and mmWave)
✓ Snapdragon Elite Gaming features
✓ 120Hz display support
✓ 200MP camera support
✓ Quick Charge 4+ support
✓ HDR10+ video capture and playback
✓ Wi-Fi 6 (802.11ax)
✓ Bluetooth 5.2
PERFORMANCE METRICS:
• AnTuTu Score: ~680,000
• Geekbench Single-core: ~1,000
• Geekbench Multi-core: ~3,300
5. COMPARATIVE ANALYSIS
TABLE 1: Processor Specifications Comparison
Specification
Manufacturer
Architecture
Process Node
CPU Cores
Max Clock Speed
GPU Cores
Neural Engine / AI
Target Device
M3 Pro
Apple / TSMC
ARM (Custom)
3nm
12 (6P + 6E)
4.05 GHz
18
16-core
Laptop
A19 Pro (Projected)
Apple / TSMC
ARM (Custom)
3nm / 2nm
6 (2P + 4E)
~4.0 GHz
6–7
16-core
Smartphone
Snapdragon 870
Qualcomm
ARM (Kryo)
7nm
8 (1+3+4)
3.2 GHz
Adreno 650
Hexagon 698
Smartphone
TABLE 2: Performance Comparison
Benchmark
M3 Pro
Geekbench Single-core ~3,100
Geekbench Multi-core ~15,000
Power Efficiency
Excellent
Thermal Management Active Cooling
KEY OBSERVATIONS:
A18 Pro (Current)
~3,200
~8,000
Excellent
Passive Cooling
Snapdragon 870
~1,000
~3,300
Good
Passive Cooling
1. Process Technology: Apple's processors (M3 Pro and A-series) use cutting-edge 3nm technology, providing
superior power efficiency compared to the Snapdragon 870's 7nm process.
2. Core Architecture: M3 Pro features the highest core count (12 cores) optimized for laptop workloads, while
smartphone processors use fewer cores optimized for mobile efficiency.
3. Performance: Apple's custom ARM designs show significant performance advantages in both single-core and
multi-core benchmarks.
4. Integration: All three processors feature integrated GPUs and AI accelerators, reflecting modern SoC design
principles.
6. PROCESSOR FAMILY COMPARISONS
6.1 LAPTOP PROCESSORS: APPLE SILICON vs. INTEL vs. AMD APPLE MSERIES (M3 Family):
Model
M3
M3Pro
M3Max
M3Ultra*
CPU Cores
8 (4P+4E)
11 /12
14 /16
24 (16P+8E)
GPUCores
8 /10
14 /18
30 /40
60 /76
TDP
~20–25W
~30–40W
~60–80W
~120–150W
COMPARISON SUMMARY:
• Architecture: Apple uses ARM (custom), Intel uses x86-64, AMD uses x86-64
• Power Efficiency: Apple Silicon leads significantly in performance-per-watt
• Performance: Intel/AMD offer higher raw multi-threaded performance in high-power configurations
• Integration: Apple's unified memory architecture provides advantages in GPU/CPU
data sharing
• Compatibility: Intel/AMD support broader software ecosystem; Apple limited to
macOS
6.2 SMARTPHONE PROCESSORS: APPLE vs. SNAPDRAGON vs. MEDIATEK
Chip
CPU Cores
GPU
Apple A16 Bionic
Apple A17 Pro
Apple A18
Apple A18 Pro
Snapdragon 870
Snapdragon 8 Gen 2
Snapdragon 8 Gen 3
Snapdragon 8 Elite
Dimensity 9000
Dimensity 9200+
Dimensity 9300
6 (2P+4E)
6 (2P+4E)
6 (2P+4E)
6 (2P+4E)
8 (1+3+4)
8 (1+3+4)
8 (1+3+2+2)
8 (2+6)
8 (1+3+4)
8 (1+3+4)
8 (1+3+4)
5-core GPU
6-core GPU
5-core GPU
6-core GPU
Adreno 650
Adreno 730
Adreno 750
Adreno 830
Mali-G710 MC10
Immortalis G715 MC11
Immortalis G720 MC12
Process
Node
4nm (N4)
3nm (N3B)
3nm (N3E)
3nm (N3E)
7nm
4nm
4nm (N4P)
3nm
4nm
4nm (N4P)
4nm
SMARTPHONE PROCESSOR COMPARISON:
• Performance: Apple A-series leads in single-core performance
• Multi-core: Snapdragon 8 Elite and Dimensity 9300 competitive in multi-core
• GPU: Apple's custom GPU architecture highly optimized; Qualcomm Adreno strong for
gaming
• AI/ML: Apple Neural Engine leads; Qualcomm and MediaTek improving rapidly
• Efficiency: Apple's 3nm chips most power-efficient
• Market: Snapdragon dominates Android flagship; MediaTek strong in mid-range
• Connectivity: Qualcomm leads in modem technology and 5G integration
.