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Lec-01 Review of MOS Operation

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Analog IC Design : 2023-24
Lecture 1
Review of MOSFET Operation
By Dr. Sanjay Vidhyadharan
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MOSFET Operation
Cut-off Region
πΉπ‘œπ‘Ÿ 𝑉𝐺𝑆 < 𝑉𝑇
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𝐼𝐷 = 0
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The Threshold Voltage
As a practical definition, The threshold Voltage VT is that gate voltage when
the surface is said to be inverted, i.e. the density of mobile electrons on the
surface becomes equal to the density of holes in the bulk (p-type) substrate.
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The Threshold Voltage
1. The work function difference TGC between the gate
and the channel reflects the built-in potential of the MOS
system,
which
consists
of
the
p-type substrate, the thin silicon dioxide layer, and the
gate electrode. Depending on the gate material, the work
function difference is
∅𝐺𝐢 = ∅𝐹_π‘†π‘’π‘π‘ π‘‘π‘Ÿπ‘Žπ‘‘π‘’ - ∅πΉπ‘šπ‘’π‘‘π‘Žπ‘™
πΉπ‘œπ‘Ÿ π‘€π‘Žπ‘‘π‘Ÿπ‘Žπ‘™ πΊπ‘Žπ‘‘π‘’
∅𝐺𝐢 = ∅𝐹_π‘†π‘’π‘π‘ π‘‘π‘Ÿπ‘Žπ‘‘π‘’ - ∅πΉπ‘ƒπ‘œπ‘™π‘¦π‘ π‘–π‘™π‘–π‘π‘œπ‘›
πΉπ‘œπ‘Ÿπ‘ƒπ‘œπ‘™π‘¦π‘ π‘–π‘™π‘–π‘π‘œπ‘› πΊπ‘Žπ‘‘π‘’
2. The externally applied gate voltage must be changed to
achieve surface inversion, i.e., to change the surface
potential by - 2 ∅ F. This will be the second component of
the threshold voltage.
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The Threshold Voltage
3. Another component of the applied gate voltage is necessary
to offset the depletion region charge, which is due to the fixed
acceptor ions located in the depletion region near the surface.
4. There always exists a fixed positive charge density Qox at
the interface between the gate oxide and the silicon
substrate, due to impurities and/or lattice imperfections at
the interface. The gate voltage component that is necessary
to offset this positive charge at the interface is - QOX/Cox.
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The Threshold Voltage
The body effect occurs in a MOSFET when the source is not tied to the substrate
(which is always connected to the most negative power supply in the integrated circuit
for n-channel devices and to the most positive for p-channel devices). The substrate
then acts as a “second gate” or a back-gate for the MOSFET
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MOSFET Current
Linear Region- Small VDS
π‘‰π‘œπ‘£ = 𝑉𝐺𝑆 - 𝑉𝑇
πΆπ‘œπ‘₯ π‘ŠπΏ =
𝑄
π‘‰π‘œπ‘£
πΆβ„Žπ‘Žπ‘Ÿπ‘”π‘’ π‘π‘’π‘Ÿ 𝑒𝑛𝑖𝑑 πΏπ‘’π‘›π‘”π‘‘β„Ž =
𝑄
= πΆπ‘œπ‘₯ π‘Šπ‘‰π‘œπ‘£
𝐿
𝑉𝐷𝑆
πΈπ‘™π‘’π‘π‘‘π‘Ÿπ‘–π‘ 𝐹𝑖𝑒𝑙𝑑 𝑖𝑛 πΆβ„Žπ‘Žπ‘›π‘›π‘’π‘™ =
𝐿
𝑉𝐷𝑆 µπ‘›
π‘‰π‘’π‘™π‘œπ‘π‘–π‘‘π‘¦ π‘œπ‘“ πΆβ„Žπ‘Žπ‘Ÿπ‘”π‘’ 𝑖𝑛 πΆβ„Žπ‘Žπ‘›π‘›π‘’π‘™(𝑣) = µπ‘› 𝐸 =
𝐿
𝑄
πΆπ‘’π‘Ÿπ‘Ÿπ‘’π‘›π‘‘ 𝑖𝑛 πΆβ„Žπ‘Žπ‘›π‘›π‘’π‘™ (𝐼𝐷 ) = 𝑣 ∗ 𝐿 =
𝑉𝐷𝑆 µπ‘›
*
𝐿
πΆπ‘œπ‘₯ π‘Šπ‘‰π‘œπ‘£
µπ‘›πΆπ‘œπ‘₯ π‘Š(𝑉𝐺𝑆 − 𝑉𝑇 )𝑉𝐷𝑆
𝐼𝐷 =
𝐿
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MOSFET Current
Linear Region- Small VDS
π‘‰π‘œπ‘£
µπ‘›πΆπ‘œπ‘₯ π‘Š(𝑉𝐺𝑆 − 𝑉𝑇 )𝑉𝐷𝑆
𝐼𝐷 =
𝐿
µπ‘›πΆπ‘œπ‘₯ π‘Šπ‘‰π‘œπ‘£
𝐿
π‘ƒπ‘Ÿπ‘œπ‘π‘’π‘ π‘  π‘‘π‘Ÿπ‘Žπ‘›π‘ π‘π‘œπ‘›π‘‘π‘’π‘π‘‘π‘Žπ‘›π‘π‘’ π‘π‘Žπ‘Ÿπ‘Žπ‘šπ‘’π‘‘π‘’π‘Ÿ π‘˜π‘›′ = µπ‘›πΆπ‘œπ‘₯
π‘‡π‘Ÿπ‘Žπ‘›π‘ π‘π‘œπ‘›π‘‘π‘’π‘π‘‘π‘Žπ‘›π‘π‘’ π‘œπ‘“ πΆβ„Žπ‘Žπ‘›π‘›π‘’π‘™ 𝑔𝐷𝑆 =
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π‘˜π‘›′ π‘Šπ‘‰π‘œπ‘£ 𝑉𝐷𝑆
𝐼𝐷 =
𝐿
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MOSFET Current
Linear Region as VDS is Increased
Charge in the tapered channel is proportional to the
channel cross-sectional area
𝑉𝐷𝑆
π‘˜π‘›′ π‘Š(π‘‰π‘œπ‘£ − 2
)𝑉𝐷𝑆
𝐼𝐷 =
𝐿
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MOSFET Current
Saturation Region
𝑉𝐷𝑆 = π‘‰π‘œπ‘£ = 𝑉𝐺𝑆 - 𝑉𝑇
𝑉𝐷𝑆
π‘˜π‘›′ π‘Š(π‘‰π‘œπ‘£ − 2
)𝑉𝐷𝑆
𝐼𝐷 =
𝐿
π‘˜π‘›′ π‘Š(𝑉𝐺𝑆 − 𝑉𝑇 )2
𝐼𝐷 =
2𝐿
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MOSFET Current
π‘˜π‘›′ π‘Š(𝑉𝐺𝑆 − 𝑉𝑇 )2
𝐼𝐷 =
2𝐿
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MOSFET OPERATION AS SWITCH
Switch OFF
NMOSFET
IOFF
Ideal = 0 Practically in pico amperes
ROFF
Ideal = ∞ Practically in Mega/Giga Ohms
Switch ON
ION
Ideal = ∞ Practically in micro amperes
RON
Ideal = 0 Practically in few Ohms
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MOSFET OPERATION AS SWITCH
NMOSFET AS SWITCH
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➒ NMOS can pass perfect 0 but not 1
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MOSFET OPERATION AS SWITCH
Switch OFF
PMOSFET
IOFF
Ideal = 0 Practically in pico amperes
ROFF
Ideal = ∞ Practically in Mega Ohms
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Switch ON
ION
Ideal = ∞ Practically in micro amperes
RON
Ideal = 0 Practically in few Ohms
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MOSFET OPERATION
PMOSFET
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MOSFET OPERATION AS SWITCH
PMOSFET AS SWITCH
➒ PMOS pass perfect 1 but not 0
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MOSFET OPERATION AS SWITCH
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MOSFET BODY CONNECTION
➒ NMOS Body to Lowest Possible Potential (Gnd)
➒PMOS Body to Highest Possible Potential (VDD)
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MOSFET BODY CONNECTION
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MOSFET BODY CONNECTION
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MOSFET BODY CONNECTION
➒ NMOS Double well : Body not same as Substrate
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Deep-submicron MOSFET operation
➒ Threshold voltage reduction
➒ VT Roll Off
➒ Drain-induced barrier lowering (DIBL)
➒ Mobility degradation due to a vertical field
➒ Velocity saturation effects
➒ Channel length modulation
➒ Subthreshold (weak inversion) conduction
➒ Hot-electron effects on output resistance
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VT Variation
➒ VT Roll Off
➒ Drain-induced barrier lowering (DIBL)
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Mobility Degradation
There also exists a normal (vertical) field originating from the gate voltage that further
inhibits channel carrier mobility. This effect, which is called mobility degradation, reduces
the surface mobility with respect to the bulk mobility.
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Velocity Saturation Effect
When the electric field reaches a critical value EC the velocity of the carriers tends to
saturate.
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Velocity Saturation Effect
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Velocity Saturation Effect
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Channel Length Modulation
When the VDS is increased beyond VOV , the pinch-off point is moved slightly away from the drain,
toward the source. The additional voltage applied to the drain appears as a voltage drop across the narrow
depletion region between the end of the channel and the drain region. This voltage accelerates the
electrons that reach the drain end of the channel and sweeps them across the depletion region into the
drain.
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Channel Length Modulation
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Channel Length Modulation
𝑉𝐴 πΈπ‘Žπ‘Ÿπ‘™π‘¦ π‘‰π‘œπ‘™π‘‘π‘Žπ‘”π‘’
1
πœ†=
𝑉𝐴
λ ∝ 1/L
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Subthreshold Conduction
where IS and n are empirical parameters, with
n > 1 and typically ranging around 1.5.
Subthreshold current has some important repercussions. In general, we want the
current through the transistor to be as close as possible to zero at VGS = 0. This is
especially important in the so-called dynamic circuits, which rely on the storage of
charge on a capacitor and whose operation can be severely degraded by subthreshold
leakage.
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Hot Carrier Effects
Increase in the electric field strength causes an increasing energy
of the electrons.
➒ Some electrons are able to leave the silicon and tunnel into the gate oxide.
➒ Such electrons are called “Hot carriers”.
➒ Electrons trapped in the oxide change the VT of the transistors.
➒ This leads to a long term reliability problem.
➒ For an electron to become hot an electric field of 104 V/cm is necessary.
➒ This condition is easily met with channel lengths below 1µm.
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Thank you
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