MICROSS CONFIDENTIAL PROPRIETARY
-Formerly Austin Semiconductor, Inc.
microSSD
TM
ruggedized environment
FEATURES:
•
Industrial Temp -40C to +85C Operation
*RoHS & Pb/Sn Ball Options
•
Industry’s Smallest ATA Solid-state Drive (PBGA Package)
- 14 x 24 x 1.3mm
•
Industry Standard ATA/IDE Bus Interface
- Host Interface: 8- or 16-bit access
- Supports up to PIO Mode-6
- Supports up to multi-word DMA Mode-4
- Supports up to ultra DMA Mode-6
•
Standard Memory Bus Interface
- Host Interface: 8- or 16-bit access
- Supports up to PIO Mode-6
•
Multi-tasking Technology Increases Performance
- Fast, Sustained Read Performance (Flash to Host),
up to 55 MB/sec
- Fast, Sustained Write Performance (Host to Flash),
up to 12 MB/sec
•
Pre-programmed Firmware in Embedded Flash
- Implements advanced wear leveling algorithms
that maximize product lifespan
- Executes industry standard ATA/IDE commands
- Embedded flash file system for seamless capacity
upgrade with no change to host software
- SLC NAND Flash
•
Extreme Low Power
- Active Mode: 125mA typical
- Sleep Mode: 0.7mA typical
•
Expanded Data Protection
- WP_PD# pin configurable by firmware for
prevention of data overwrites
- Added data security through user-selectable
protection zones
•
Smart Commands
- Enables alerts indicating the remaining product life
•
Built-in ECC
- Up to 7 million write cycles
•
Multiple Densities with the Same Ball-Print
- 4GB, 8GB
- SATA versions planned in the future
APPLICATIONS:
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Military / Aerospace
Micro UAV’s
Future Combat Soldier
Heads-up Display
Targeting Systems
Surveillance
Security Monitoring Devices
Transportation
Industrial / Ruggedized PC’s
Netbook / Mobile Computing
Automation / Control
Test / Measurement
Medical Equipment
5 1 2 . 3 3 9 . 1 1 8 8 ~ w w w.m icross.com
PACKAGE DIAGRAMS (mm)
MICROSS CONFIDENTIAL PROPRIETARY
TOP VIEW
DETAIL
10
0.40 ±0.05
9
1.30
± 0.15
8
7
6
0.15
14.0
±0.1
5
SEATING PLANE
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
Note: 1. All linear dimensions are in millimeters.
2. Untoleranced dimensions are nominal target values.
3. Coplanarity: 0.15 mm.
4. Ball opening size is 0.40 mm (± 0.05 mm).
24.0 ±0.1
A1
CORNER
BOTTOM VIEW
15.0
9.0
0.50
± 0.05
(91x)
1.0
1
2
3
4
9.0
5
6
7.0
7
8
9
10
1.0
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
SIDE VIEW
1mm
BLOCK DIAGRAM
SRAM Buffer
EEC
Internal DMA
PMU
Capacity
MCU
PartNumber
Multitasking Interface
HOST
ATA/IDE
Bus
or
Memory
Bus
Embedded
Flash File
System
Flash
Media
SCI
Package
4GB
Pb/SnBallVersion 14x24x1.3mm
PBGA
AS3uSSD4GB28PBGR RoHSCompliant
8GB
Pb/SnBallVersion 14x24x1.3mm
PBGA
AS3uSSD8GB55PBGR RoHSCompliant
Rev. 1.2 4/10
AS3uSSD4GB28PBG
AS3uSSD8GB55PBG
Phone: 512.339.1188
semiconductors@micross.com
www.micross.com