Memorandum
To:
From:
CC:
Date:
Re:
RNSavage
Bruce Mayer, PE
14-Jun-01
Weekly Report for: 11-Jun-01 14-Jun-01
Previous Week Accomplishments
Perkin-Elmer MHL-535 Follow up
 With help from MHL-Team, Replied to P-E question about CD Measurement thru Thick
PhotoResist
o Data & Explanation Satisfied P-E
AL-3100 S2/S8 Review
 S2 SubReports for Robot & FOUP-LoadPort
o Received From Rorze report for Robot-Arm, and Robot-Xlate Stage
o With help from Mr. Hoshino the TDC TAS-300 Report is on the way by DHL
 Have Prelim Report S2_PreLim_210222L.doc
o Will Today Send Full-Report and Analysis to Mr. Kitahara
 Input to FR-3220 Bridge-Tool Design
SEMIcon West2001 Support
 Made Recommendation for Tatsuno Support Engr  Mr. Koike
 Made Detailed Schedule for Moving, Set-Up, Return of Lab-3100
o >56 Task Items
 Researched Potential Crating Companies
o Suggested to R. Abea that we get quote from Trans-Pak in San Jose
 Worked with Booth Design Firm, Sierra Group, on Equipment Layout
o Obtained their CAD dwg, then added CAD Models for 3100 & MX80
 Learned that 3100 will interfere with LCD projector
 Taked to Jim Kelly at SG; we tentatively decide to replace the LCD
proj. with a Flat Panel Display
Supported Hynix -Site Effort
 Wrote OutLine Plan on how to approach Safety/Electrical Code requirements of the City of
Eugene
o This approach is not acceptable to Hynix; We need full S2 certification
 Move away from 2100 and concentrate on FR-3220
 Reviewed RNS -site Technical Proposal
Completed MapStage ADC CoOrd Transformation Validation Analysis
 The 5-Parameter Distortion model strongly appears to be validated
o Present in Detail The Results 14Jun/1400hrs
Bruce Mayer, PE • pg 1 • 29-May-16 • 291219200
Plans for Next Week






Review TI ADC System/Hardware Spec
Support SEMICon Effort as Needed
o Procure RF ID tag retainers for 300mm FOUP for DPP/SEMICon
Flow Charts related to Wafer CoOrd Transform SW Algorithm Development
P-E MHL Follow up: Help Determine Objective Lens Selection
Write Prior-Stage Accuracy/Repeatability Report
In the BullPen
o Hardware Design Plan for 200mm wafers in 3100
o Investigation Into Interferometer control of 3100 Stage
 Use Contractor?
 Perhaps Alex Anderson [mailto:aanderson@brsco.com]
o Recommended by RLF 13Jun
Print date/time = 29-May-16/03:57
Appendix
follows
Bruce Mayer, PE • pg 2 • 29-May-16 • 291219200
Perkin-Elemer Reponse on Obj vs PR-Depth
MHL-535 Auto-CD Measurement PhotoResist-Depth Capability
Objective Lens Magnification
100X
0.87
50X
2.50
20X
6.10
18.00
10X
NOTES:
- Per Advice From K. Hokimoto • 12Jun01
5X
70.00
0
Focus_v_PR-depth_0106.xls
25
50
75
Maximum PhotoResist Depth (µm)
Bruce Mayer, PE • pg 3 • 29-May-16 • 291219200
SEMICon-West2001 Booth Layout
Bruce Mayer, PE • pg 4 • 29-May-16 • 291219200
SEMICon-West2001 3100 Move Schedule
Bruce Mayer, PE • pg 5 • 29-May-16 • 291219200
2nd Set - DataPoint Locations
• Notes
– Die-Grid Not to
Scale
Pt
A
B
C
D
E
F
G
H
I
J
K
L
M
Die
Location
(-8,0)
(7,0)
(0,8)
(0,0)
(0,-8)
(-3,3)
(3,3)
(3,-3)
(-3,-3)
(-5,6)
(6,6)
(6,-6)
(-6,-6)
Map (µm)
x
y
-80164
200
69206
200
-500 80488
-500
200
-500 -80088
-30374 30308
29374 30308
29374 -29908
-30374 -29908
-50290 60416
59248 60416
59248 -60016
-60248 -60016
C
K
J
G
F"
A
D
B
H
I"
L
M"
E"
Bruce Mayer, PE • pg 6 • 29-May-16 • 291219200
J
K
L
M"
Absolute Aim ImproveMent - X CoOrd
G
F"
E"
D
C
B
CALC = Abs(x'c - x'm)
A
Die Point
H
I"
E"
MAP =Abs(x - x'm)
0
25
50
75
X-Distance From Target
100
(µm)
125
150
175
Triangulation_010612.xls
Bruce Mayer, PE • pg 7 • 29-May-16 • 291219200
J
K
L
M"
Absolute Aim ImproveMent - Y CoOrd
G
F"
E"
D
C
B
CALC = Abs(y'c - y'm)
MAP =Abs(y - y'm)
A
Die Point
H
I"
A
0
25
50
75
Y-Distance From Target
100
(µm)
125
150
175
Triangulation_010612.xls
Bruce Mayer, PE • pg 8 • 29-May-16 • 291219200
Bruce Mayer, PE • pg 9 • 29-May-16 • 291219200